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CHIPNOVA presents at China Materials Conference 2021
2022-02-19
From July 9 to 11, 2021 China Materials Conference was held in Xiamen International Convention and Exhibition Center. CHIPNOVA presented the world's leading in situ electron microscopy solutions.
At the exhibition site, CHIPNOVA displayed various series of TEM in-situ sample rod, SEM in-situ sample bench, nano flow control system, high vacuum rod holder, leak detector and other products. For the first time, many products such as SEM cold bench were displayed to the outside world, attracting many experts, scholars, and electron microscope users to exchange and consultation.
During the exhibition, Prof. Liao Honggang, founder of CHIPNOVA and Professor of Xiamen University, received an exclusive interview from several media, introducing the company's current products and future development.
The organizer of the conference invited Prof. Liao Honggang to give a special report on the Study of in Situ Liquid Transmission Electron Microscopy (TEM) on Electrochemical solid-liquid interface, showing some of the results obtained by using in situ liquid electron microscopy.
CHIPNOVA has a high-quality team of more than 60 strong R&D force, advanced processing equipment, complete testing means, excellent product quality, has passed the 1S09001 quality management system certification. Established a complete chip R&D and production line, master the world's leading in situ chip technology, with Berkeley Nanolab, Xiamen University and other universities and research institutes to establish a close R & D cooperation, committed to provide the majority of scientific research customers with professional in situ electron microscope solutions.