Spring Series In-Situ Holders(Heating)
Product Features
A liquid-environment nanolab is constructed in the in-situ sample stage using MEMS micromachining technology. By heating with an MEMS chip and combining multiple modes such as EDS, EELS, SAED, HRTEM, and STEM, real-time and dynamic monitoring of key information at the nanoscale or even atomic scale is achieved, including the microstructural evolution, reaction kinetics, phase transition, element valence state, chemical changes, microstress, and atomic-scale structural and compositional evolution at the surface/interface of the sample in the liquid environment as it changes with temperature.
- Product composition
- Unique Advantages
- Functional Parameters
- Application
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a.Spring Series In-Situ Holders(Heating) b.MEMS Liquid Heating Cell Chip (Fluid) c.Heating Control Software d.Thermal Controller e.High-precision Chip Assembly Instrument f.High Vacuum Leak Checking Station g.In-situ Nanofluidic Control System (Liquid) h.Accessory Package i.Cleaning Instrument for Sample Holders j.Environment Gloves Box -
Highest resolution in the industry ·1.Unique MEMS processing technology, with a silicon nitride film thickness of up to 10nm in the chip window area. ·2.The chip packaging adopts a dual-insurance method of internal bonding and external epoxy resin sealing, making the interlayer between chips as thin as only about 100-200nm. The ultra-thin interlayer greatly reduces interference with the electron beam, allowing clear observation of the atomic arrangement of samples, and atomic-level resolution can be achieved in the liquid phase environment. ·3.The specially designed shape of the chip viewing window can avoid the bulging of the silicon nitride film that causes the liquid layer to thicken and affect the resolution. High security ·1.Other common liquid sample holders of other brands on the market, due to the constraints of their own liquid cell chip design, can only push large-flow liquid through the sample stage and the peripheral area of the chip by the huge pressure generated by the liquid pump, posing a safety hazard of large-scale liquid leakage. Their liquid mainly enters the nanochannel in the middle of the chip by diffusion effect, and there is no real flow rate control in the chip observation window. ·2.Nanofluidic control technology is employed, with fluid differential control implemented via a piezoelectric micro-control system to achieve nanoliter-scale trace fluid delivery. The residual liquid volume in both the in-situ nanofluidic control system and the sample rod is only at the microliter level, effectively ensuring the safety of the electron microscope. ·3.By adopting the polymer membrane surface contact sealing technology, compared with O-ring sealing, the sealing contact area is increased, which effectively reduces the risk of leakage. ·4.By adopting the ultra-high temperature coating technology, the silicon nitride film in the chip window area exhibits advantages such as high temperature resistance, low stress, pressure resistance, corrosion resistance, and radiation resistance. Unique multi-field coupling technology ·It can realize the multi-field coupling of light, electricity, heat, and fluid in a liquid-phase environment. Excellent Thermal Performance ·1.High-precision infrared temperature measurement and calibration, along with micron-scale high-resolution thermal field measurement and calibration, ensure temperature accuracy. ·2.High-stability precious metal heating wires (non-ceramic materials) are used, which serve as both thermal conductive materials and thermosensitive materials. Their resistance has a good linear relationship with temperature. The heating area covers the entire observation region, with fast heating and cooling rates, stable and uniform thermal field, and temperature fluctuation ≤±0.1℃ in a stable state. ·3.A closed-loop ultra-high frequency dynamic control and feedback temperature control method is adopted. High-frequency feedback control eliminates errors, achieving a temperature control precision of +0.01℃. ·4.The unique multi-stage composite heating MEMS chip design controls thermal diffusion during heating, greatly suppressing thermal drift during temperature rise and ensuring efficient observation in experiments. Intelligent Software and Automated Equipment ·1.Man-machine separation is realized: experimental conditions are remotely controlled via software, and detailed experimental data is automatically recorded throughout the entire process, facilitating experiment summary and review. ·2.Customizable programmed temperature-rise curves. It supports defining more than 10 temperature-rise steps, constant temperature duration, etc. Meanwhile, the target temperature and duration can be manually controlled. If there is a need to adjust the temperature (for temperature change or constant temperature) during the programmed temperature-rise process, the experimental scheme can be modified in real time, improving experimental efficiency ·3.Built-in absolute temperature scale calibration program. For each temperature control operation of every chip, curve fitting and calibration are re-conducted based on changes in resistance value, ensuring the accuracy of measured temperature and guaranteeing the reproducibility and reliability of heating experiments. ·4.Precision automated equipment is equipped throughout the entire workflow to assist manual operations and enhance experimental efficiency. Team Advantages ·1.Team leaders participated in the development and completio
of in situ liquid phase TEM at the early stage of development.·2.The team independently designs in-situ chips and masters the core processes of chip manufacturing. ·3.With more than 20 members engaged in in-situ liquid-phase TEM research, the team can provide in-situ experimental technical support for multiple research directions. -
Category Index Functional Parameters Basic parameters Window thickness High strength titanium alloy Film thickness 20nm(Support ugrande to 10nm) Applicable TEM brand Thermo Fisher/FEI, JEOL, Hitachi Applicable Pole Piece ST, XT, T, BioT, HRP, HTP, CRP Tilt Angle α=±20° (Actual range depends on electron microscope and pole piece model) (HR)TEM/STEM Supported (HR)EDS/EELS Supported -

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