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Spring Series In-Situ Stages(Electrochemistry)

Product Features

Through MEMS chips to apply electrical signals to thin-layer or nano-battery systems, combined with a variety of different modes such as EDS, real-time and dynamic monitoring of key information such as microstructure evolution, reaction dynamics, phase transformation, chemical changes, surface/interface structure and composition evolution at the nano level can be achieved.

  • Product composition
  • Unique Advantages
  • Functional Parameters
  • Application
  • a.Spring Series In-Situ Stages(Electrochemistry)
    b.Eletron Microscope Flange 
    c.in-situ stage storage box
    d.MEMS Electrochemistry Liquid Cell Chip (Static, Fluid)
    e.Voltage Control Software
    f.Electrochemical Work Station
    g.Microfluidic Circulation System (Liquid)
    h.High-precision Chip Assembly Instrument
    i.SEM High Vacuum Leak Checking Station
    j.Environment Gloves Box
    k.Accessory Package


    Highest resolution in the industry

    ·The original MEMS micromachining process enables the nitriding of the electrochemical chip window area The thickness of the silicon film can be as thin as 10nm, which greatly reduces the interference to the electron beam.The liquid phase environment can achieve nanoscale resolution.

    High security

    ·1.Other brands of liquid sample tables commonly available on the market are subject to their own liquid pool core The sheet design scheme is restricted and can only be driven by the huge pressure generated by the liquid pump Flow liquid flows through the sample table and the peripheral area of the chip, and there is a large amount of liquid leakage Security risks. The liquid enters the nanopore in the middle of the chip mainly by diffusion effect There is no real flow rate control in the chip observation window.

    ·2.Using microfluidic technology, the fluid differential control is carried out by piezoelectric microcontrol system To realize micro-upgrading of micro-fluid conveying, liquid microfluidic circulation system and sample The amount of redundant liquid in the product table is only slightly higher, which effectively ensures the safety of electron microscopy.
    ·3.The polymer membrane surface contact sealing technology is used, which is larger than O-ring sealing The sealed contact area effectively reduces the risk of leakage.
    ·4.Using ultra-high temperature coating technology, the silicon nitride film in the chip window area is resistant High temperature, low stress, pressure, corrosion and radiation resistance.
    Unique multi-field coupling technology

    ·It can realize multi-field coupling of light,electricity,heat and fluid in liquid phase environment.

    Intelligent software and automation equipment ·1.Man-machine separation, software remote control experimental conditions, automatic recording of the whole experiment Detailed data for summary and review.
    ·2.The whole process is equipped with precision automation equipment to assist manual operation and improve experiments Efficiency.
    Advantages of R&D team ·1.The team leader participated in the development and completion of in situ liquid phase TEM at the early stage of development Good the method.
    ·2.Design in-situ chip independently, master chip core technology, and own a number of chips Patent.
    ·3.More than 20 members of the team are engaged in in-situ liquid phase research, which can provide multiple research directions In situ experimental technical support.



     Category Index Numerical value
    Basic parameters Shaft material High strength titanium alloy
    Film thickness 20nm ( standard)
    Rotation Angle ±180° (depending on the actual SEM model)


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    Electrochemical dissolution

    Electrochemical deposition



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